意法半導體STM32H725/735系列微控制器選型表及現貨

來源：中芯巨能：提供選型指導+現貨供應+技術支持| 發布日期：2024-10-08 16:00:01 瀏覽量：

意法半導體STM32H725/735系列內含工作頻率高達550 MHz的Arm? Cortex?-M7內核（具有雙精度浮點單元），可選擴展室溫范圍最高為125 °C (*)。采用BGA和LQFP配置文件，提供100至176引腳的封裝，以及VFQFN68和WLCSP115封裝。代理銷售意法半導體旗下全系列IC電子元器件-中芯巨能為您提供意法半導體STM32H730超值系列選型表及現貨。

中芯巨能現貨供應意法半導體STM32H730系列產品，2小時可發貨，為制造業廠家提供選型指導+樣片測試+技術支持等服務。如需選型指導、樣片測試、采購、BOM配單等需求，請加客服微信：13310830171。

型號	描述	封裝
STM32H725AE	High-performance and DSP with DP-FPU, Arm Cortex-M7 MCU with 512 KBytes Flash, 564 KBytes RAM, 550 MHz CPU, L1 cache, extenal memory interface, SMPS, subset of peripherals	UFBGA 169 7x7x0.6 P 0.5 mm
STM32H725AG	High-performance and DSP with DP-FPU, Arm Cortex-M7 MCU with 1 MByte Flash, 564 KBytes RAM, 550 MHz CPU, L1 cache, extenal memory interface, SMPS, subset of peripherals	UFBGA 169 7x7x0.6 P 0.5 mm
STM32H725IE	High-performance and DSP with DP-FPU, Arm Cortex-M7 MCU with 512 KBytes Flash, 564 KBytes RAM, 550 MHz CPU, L1 cache, extenal memory interface, SMPS, subset of peripherals	LQFP 176 24x24x1.4 mm, UFBGA 176+25 10x10x0.6 P 0.65 mm
STM32H725IG	High-performance and DSP with DP-FPU, Arm Cortex-M7 MCU with 1 MByte Flash, 564 KBytes RAM, 550 MHz CPU, L1 cache, extenal memory interface, SMPS, subset of peripherals	LQFP 176 24x24x1.4 mm, UFBGA 176+25 10x10x0.6 P 0.65 mm
STM32H725RE	High-performance and DSP with DP-FPU, Arm Cortex-M7 MCU with 512 KBytes Flash, 564 KBytes RAM, 550 MHz CPU, L1 cache, extenal memory interface, SMPS, subset of peripherals	VFQFPN 68 8x8x1.0 mm
STM32H725RG	High-performance and DSP with DP-FPU, Arm Cortex-M7 MCU with 1 MByte Flash, 564 KBytes RAM, 550 MHz CPU, L1 cache, extenal memory interface, SMPS, subset of peripherals	VFQFPN 68 8x8x1.0 mm
STM32H725VE	High-performance and DSP with DP-FPU, Arm Cortex-M7 MCU with 512 KBytes Flash, 564 KBytes RAM, 550 MHz CPU, L1 cache, extenal memory interface, SMPS, subset of peripherals	LQFP 100 14x14x1.4 mm, TFBGA 100 8x8x1.2 P 0.8 mm
STM32H725VG	High-performance and DSP with DP-FPU, Arm Cortex-M7 MCU with 1 MByte Flash, 564 KBytes RAM, 550 MHz CPU, L1 cache, extenal memory interface, SMPS, subset of peripherals	LQFP 100 14x14x1.4 mm, TFBGA 100 8x8x1.2 P 0.8 mm, WLCSP 115 3.8x4.2x0.6 P 0.35 mm
STM32H725ZE	High-performance and DSP with DP-FPU, Arm Cortex-M7 MCU with 512 KBytes Flash, 564 KBytes RAM, 550 MHz CPU, L1 cache, extenal memory interface, SMPS, subset of peripherals	LQFP 144 20x20x1.4 mm
STM32H725ZG	High-performance and DSP with DP-FPU, Arm Cortex-M7 MCU with 1 MByte Flash, 564 KBytes RAM, 550 MHz CPU, L1 cache, extenal memory interface, SMPS, subset of peripherals	LQFP 144 20x20x1.4 mm
STM32H735AG	High-performance and DSP with DP-FPU, Arm Cortex-M7 MCU with 1 MByte Flash, 564 KBytes RAM, 550 MHz CPU, L1 cache, extenal memory interface, SMPS, subset of peripherals including a Crypto accelerator	UFBGA 169 7x7x0.6 P 0.5 mm
STM32H735IG	High-performance and DSP with DP-FPU, Arm Cortex-M7 MCU with 1 MByte Flash, 564 KBytes RAM, 550 MHz CPU, L1 cache, extenal memory interface, SMPS, subset of peripherals including a Crypto accelerator	LQFP 176 24x24x1.4 mm, UFBGA 176+25 10x10x0.6 P 0.65 mm
STM32H735RG	High-performance and DSP with DP-FPU, Arm Cortex-M7 MCU with 1 MByte Flash, 564 KBytes RAM, 550 MHz CPU, L1 cache, extenal memory interface, SMPS, subset of peripherals including a Crypto accelerator	VFQFPN 68 8x8x1.0 mm
STM32H735VG	High-performance and DSP with DP-FPU, Arm Cortex-M7 MCU with 1 MByte Flash, 564 KBytes RAM, 550 MHz CPU, L1 cache, extenal memory interface, SMPS, subset of peripherals including a Crypto accelerator	LQFP 100 14x14x1.4 mm, TFBGA 100 8x8x1.2 P 0.8 mm, WLCSP 115 3.8x4.2x0.6 P 0.35 mm
STM32H735ZG	High-performance and DSP with DP-FPU, Arm Cortex-M7 MCU with 1 MByte Flash, 564 KBytes RAM, 550 MHz CPU, L1 cache, extenal memory interface, SMPS, subset of peripherals including a Crypto accelerator	LQFP 144 20x20x1.4 mm